Bộ vy xử lý intel core i5-6300u là một ULV (điện áp cực thấp) SoC lõi kép dựa trên kiến trúc Skylake và đã được đưa ra vào tháng năm 2015. Các CPU có thể được tìm thấy trong ultrabooks cũng như máy tính xách tay bình thường. Ngoài hai lõi CPU với Hyper-Threading tốc độ 2,4 – 3,0 GHz (2 lõi: tối đa 2,9 GHz), chip còn tích hợp GPU HD Graphics 520 và bộ điều khiển bộ nhớ DDR4-2133 / DDR3L-1600 kênh đôi. SoC được sản xuất bằng quy trình 14nm với các bóng bán dẫn FinFET.
Kiến trúc intel core i5-6300u
Skylake thay thế cả Haswell và Broadwell và mang cùng một kiến trúc vi mô trong mọi lớp TDP từ 4,5 đến 45 W. Các cải tiến mở rộng của thiết kế Skylake bao gồm tăng bộ đệm ngoài trật tự, tối ưu hóa tìm nạp trước và dự đoán chi nhánh cũng như tăng hiệu suất bổ sung thông qua Hyper -Đọc. Tuy nhiên, nhìn chung, hiệu suất trên mỗi đồng hồ đã tăng chỉ 5 đến 10 phần trăm (so với Haswell) tương ứng dưới 5 phần trăm (so với Broadwell), khá khiêm tốn cho một kiến trúc mới (“Tock”).
Theo tốc độ xung nhịp được chỉ định và kiến trúc được cải thiện, intel core i5-6300u sẽ hoạt động tương tự (hoặc cao hơn một chút) Core i7-5500U trước đây (Broadwell, 15 W). Do đó, CPU có đủ năng lượng cho các mục đích văn phòng và đa phương tiện cũng như các ứng dụng và đa nhiệm đòi hỏi khắt khe hơn.
Đơn vị đồ họa tích hợp có tên HD Graphics 520 đại diện cho phiên bản “GT2” của GPU Skylake (Intel Gen. 9). 24 Đơn vị thực thi, còn được gọi là EU, có tốc độ 300 – 1000 MHz và cung cấp hiệu suất ở đâu đó trong phạm vi của GeForce 820M chuyên dụng . Trò chơi của năm 2015 do đó có thể được chơi trơn tru trong cài đặt thấp. Để biết thêm thông tin về hiệu suất và tính năng, hãy kiểm tra trang của chúng tôi để biết HD Graphics 520 .
Sự tiêu thụ năng lượng
Được chỉ định ở mức TDP 15 W (bao gồm CPU, GPU và bộ điều khiển bộ nhớ), CPU phù hợp nhất cho máy tính xách tay nhỏ và ultrabook (11 inch trở lên). Tùy chọn, TDP có thể được hạ xuống 7,5 watt (giảm CTDP), giảm cả tản nhiệt và hiệu suất và cho phép các thiết kế nhỏ gọn hơn.
|Series||Intel Core i5|
|Series: Core i5 Skylake||
|Clock Rate||2400 – 3000 MHz|
|Level 1 Cache||128 KB|
|Level 2 Cache||512 KB|
|Level 3 Cache||3 MB|
|Number of Cores / Threads||2 / 4|
|Max. Power Consumption (TDP = Thermal Design Power)||15 Watt|
|Manufacturing Technology||14 nm|
|Die Size||99 mm2|
|Max. Temperature||100 °C|
|Features||Dual-Channel DDR3L-1600/DDR4-2133 Memory Controller, HyperThreading, AVX, AVX2, Quick Sync, Virtualization, AES-NI, vPro, TXT|
|GPU||Intel HD Graphics 520 (300 – 1000 MHz)|
|64 Bit||64 Bit support|
|Starting Price||$281 U.S.|
|Announcement Date||09/01/2015 = 1639 days old|
|Product Link (external)||Intel Core i5 6300U|
OS: Windows 11* Windows 10, 64-bit*
OS: Windows 10, 64-bit*
OS: Windows 10, 64-bit*
OS: Windows 10, 64-bit* Windows 8.1, 64-bit* Windows 7, 32-bit* Windows 7, 64-bit*
OS: Windows 10, 64-bit* Windows 8.1, 64-bit* Windows 7, 32-bit* Windows 7, 64-bit*
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
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# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor”s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an issf.vn integrated memory controller and an issf.vn I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an issf.vn-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-up Frequency
Configurable TDP-up Frequency is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Base Frequency is where the Configurable TDP-up is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-up is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an issf.vn-defined, high-complexity workload.
Configurable TDP-down Frequency
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an issf.vn-defined, high-complexity workload.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for issf.vnligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your issf.vn representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ‡
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
Graphics Output defines the interfaces available to communicate with display devices.
4K support indicates the product”s support of 4K resolution, defined here as minimum 3840 x 2160.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (eDP – Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
Max Resolution (VGA)‡
Max Resolution (VGA) is the maximum resolution supported by the processor via the VGA interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
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OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Junction Temperature is the maximum temperature allowed at the processor die.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which issf.vn’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core”s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
issf.vn ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. issf.vn refers to these processors as tray or OEM processors. issf.vn doesn”t provide direct warranty support. Contact your OEM or reseller for warranty support.
What is the difference between Boxed and Tray Processors?
Downloads and Software
Warranty and Replacement
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for missf.vnet availability.
issf.vn processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.issf.vn.com/content/www/us/en/processors/processor-numbers.html for details.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
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